芯片产业
(H30007.csi)A股通融申编制方案单张
(
市盈率
74.70
市净率
7.36
股息率
0.15%
[静0.13%]
)·总市值加权
发布时间2012-12-20样本数50调样频率半年类型主题热点收盘点位3,746.48点位涨跌幅-0.33%成交金额1,222.99亿元总市值6.49万亿元A股市值5.50万亿元流通市值5.14万亿元自由流通市值3.47万亿元A股场内基金资产规模80.14亿元前十大权重55.90%有数据以来全收益年化涨跌幅11.95%陆股通持仓金额占市值比例3.76% (3,961.50亿元2026-06-30) 融资融券余额占市值比例2.55% (融资余额1,651.13亿元融券余额9.03亿元2026-10-08) 发布以来年化涨跌幅13.04%
中证芯片产业指数中证芯片产业指数选取业务涉及芯片设计、制造、封装与测试等领域,以及为芯片提供半导体材料、晶圆生产设备、封装测试设备等物料或设备的上市公司证券作为指数样本,以反映芯片产业上市公司证券的整体表现。®基础数据源自中证指数公司。指数估值数据计算说明文档指数财务数据计算说明文档
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芯片产业(H30007) - 历史市净率(总市值加权)及分位点走势图

最后更新于:2026-10-09

市净率

  • 当前值:7.362
  • 当前分位点74.38%
  • 80%分位点7.729
  • 50%分位点5.390
  • 20%分位点3.815
  • 最大值:12.918
  • 平均值:5.912
  • 最小值:3.150
日期收盘点位市净率分位点20%分位点50%分位点80%分位点
2026-10-093,746.487.36274.38%3.8155.3907.729
2026-10-083,758.927.38175.07%3.8155.3897.729
2026-09-303,912.027.69379.59%3.8155.3897.729
2026-09-294,036.127.95883.70%3.8155.3897.729
2026-09-284,013.417.90783.13%3.8155.3887.719
2026-09-244,197.968.26287.05%3.8155.3787.707
2026-09-234,308.828.45088.83%3.8155.3787.684
2026-09-224,320.918.48188.95%3.8155.3777.683
2026-09-214,283.068.41688.95%3.8155.3767.679
2026-09-184,270.228.39988.98%3.8155.3707.665
2026-09-174,118.988.10186.36%3.8155.3697.648
2026-09-164,145.178.16987.03%3.8155.3687.642
2026-09-153,970.137.84883.29%3.8155.3677.641
2026-09-143,897.937.71981.22%3.8155.3667.636
2026-09-113,972.777.87284.02%3.8155.3567.629
2026-09-104,030.617.98585.26%3.8155.3547.612
2026-09-094,052.378.03585.79%3.8155.3497.588
2026-09-084,077.958.11586.60%3.8155.3447.552
2026-09-074,135.328.23487.43%3.8155.3367.549
2026-09-044,024.828.03186.09%3.8155.3337.542
2026-09-034,147.068.28888.02%3.8155.3337.517
2026-09-024,176.548.32988.41%3.8155.3327.506
2026-09-014,252.058.48689.09%3.8155.3307.503
2026-08-314,371.468.71290.33%3.8155.3297.491