芯片产业
(H30007.csi)A股通编制方案单张
(
市盈率
133.94
市净率
9.99
股息率
0.12%
[0.12%]
)·市值加权
发布时间2012-12-20样本数49调样频率半年类型主题热点收盘点位4,667.93点位涨跌幅2.17%成交金额2,485.20亿市值7.28万亿A股市值6.40万亿流通市值6.04万亿自由流通市值3.97万亿A股场内基金资产规模76.38亿前十大权重60.58%发布以来年化涨跌幅16.42%有数据以来全收益年化涨跌幅16.31%陆股通持仓金额占市值比例3.05% (1,581.63亿2025-12-31) 融资融券余额占市值比例2.76% (融资余额1,963.92亿融券余额7.94亿2026-06-03)
中证芯片产业指数选取业务涉及芯片设计、制造、封装与测试等领域,以及为芯片提供半导体材料、晶圆生产设备、封装测试设备等物料或设备的上市公司证券作为指数样本,以反映芯片产业上市公司证券的整体表现。®基础数据源自中证指数公司指数估值数据计算说明文档指数财务数据计算说明文档
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芯片产业(H30007) - 历史市净率(市值加权)及分位点走势图

最后更新于:2026-06-04

市净率

  • 当前值:9.986
  • 当前分位点99.17%
  • 80%分位点6.976
  • 50%分位点5.146
  • 20%分位点3.815
  • 最大值:10.786
  • 平均值:5.318
  • 最小值:3.150
日期收盘点位市净率分位点20%分位点50%分位点80%分位点
2026-06-044,667.939.98699.17%3.8155.1466.976
2026-06-034,568.719.80599.03%3.8155.1466.974
2026-06-024,422.229.51198.62%3.8155.1456.973
2026-06-014,353.899.35598.20%3.8155.1406.964
2026-05-294,609.569.91699.17%3.8155.1316.948
2026-05-284,874.9410.54599.72%3.8155.1296.943
2026-05-274,845.4810.38299.72%3.8155.1296.935
2026-05-264,957.5210.64699.86%3.8155.1296.917
2026-05-255,016.4010.786100.00%3.8155.1246.917
2026-05-224,696.799.99599.86%3.8155.1076.899
2026-05-214,579.329.76499.86%3.8155.0986.879
2026-05-204,753.8910.175100.00%3.8155.0956.879
2026-05-194,549.639.700100.00%3.8155.0936.863
2026-05-184,389.049.36499.72%3.8155.0856.862
2026-05-154,337.879.28499.45%3.8155.0736.853
2026-05-144,363.569.35699.72%3.8155.0646.852
2026-05-134,473.309.613100.00%3.8155.0586.851
2026-05-124,341.849.374100.00%3.8155.0576.847
2026-05-114,319.209.304100.00%3.8155.0556.842
2026-05-084,051.868.57199.72%3.8155.0476.824
2026-05-074,165.708.829100.00%3.8155.0446.824
2026-05-064,107.278.711100.00%3.8155.0426.803
2026-04-303,866.278.08598.34%3.8155.0366.784
2026-04-293,694.457.83195.58%3.8155.0336.782