芯片产业
(H30007.csi)A股通编制方案单张
(
市盈率
121.49
市净率
7.55
股息率
0.15%
[0.11%]
)·市值加权
发布时间2012-12-20样本数50调样频率半年类型主题热点收盘点位3,461.78点位涨跌幅0.50%成交金额1,285.83亿市值5.51万亿A股市值4.83万亿流通市值4.51万亿自由流通市值2.90万亿A股场内基金资产规模62.89亿前十大权重57.31%发布以来年化涨跌幅11.20%有数据以来全收益年化涨跌幅11.47%陆股通持仓金额占市值比例3.05% (1,581.63亿2025-12-31) 融资融券余额占市值比例2.55% (融资余额1,386.80亿融券余额5.95亿2026-04-16)
中证芯片产业指数选取业务涉及芯片设计、制造、封装与测试等领域,以及为芯片提供半导体材料、晶圆生产设备、封装测试设备等物料或设备的上市公司证券作为指数样本,以反映芯片产业上市公司证券的整体表现。®基础数据源自中证指数公司指数估值数据计算说明文档指数财务数据计算说明文档
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芯片产业(H30007) - 历史市净率(市值加权)及分位点走势图

最后更新于:2026-04-17

市净率

  • 当前值:7.552
  • 当前分位点93.38%
  • 80%分位点6.656
  • 50%分位点5.006
  • 20%分位点3.815
  • 最大值:8.394
  • 平均值:5.126
  • 最小值:3.150
日期收盘点位市净率分位点20%分位点50%分位点80%分位点
2026-04-173,461.787.55293.38%3.8155.0066.656
2026-04-163,444.457.46992.14%3.8155.0066.654
2026-04-153,402.407.42591.44%3.8155.0036.629
2026-04-143,421.757.43391.70%3.8155.0016.609
2026-04-133,336.797.26789.63%3.8155.0016.598
2026-04-103,315.677.21888.55%3.8155.0066.569
2026-04-093,252.257.10086.62%3.8155.0066.553
2026-04-083,250.447.10086.74%3.8155.0036.539
2026-04-073,054.316.68881.19%3.8155.0016.485
2026-04-033,001.286.53980.28%3.8155.0066.420
2026-04-023,007.076.55380.41%3.8155.0016.389
2026-04-013,105.256.77482.04%3.8154.9996.181
2026-03-313,010.716.56980.64%3.8154.9986.150
2026-03-303,123.066.82482.71%3.8154.9976.102
2026-03-273,133.096.86383.72%3.8154.9806.089
2026-03-263,118.766.82482.90%3.8154.9576.078
2026-03-253,201.746.99485.64%3.8154.9506.071
2026-03-243,123.116.84283.13%3.8154.9436.059
2026-03-233,069.806.71182.30%3.8154.9356.057
2026-03-203,234.967.06586.21%3.8154.9205.966
2026-03-193,294.237.20888.55%3.8154.9015.960
2026-03-183,383.937.39191.30%3.8154.8945.954
2026-03-173,299.527.23689.21%3.8154.8925.921
2026-03-163,391.567.43291.70%3.8154.8905.912