芯片产业
(H30007.csi)A股通编制方案单张
(
市盈率
99.79
市净率
8.58
股息率
0.12%
[0.12%]
)·市值加权
发布时间2012-12-20样本数50调样频率半年类型主题热点收盘点位4,310.89点位涨跌幅0.38%成交金额1,332.48亿市值7.41万亿A股市值6.28万亿流通市值5.88万亿自由流通市值3.96万亿A股场内基金资产规模89.22亿前十大权重55.47%发布以来年化涨跌幅14.72%有数据以来全收益年化涨跌幅14.63%陆股通持仓金额占市值比例3.05% (1,581.63亿2025-12-31) 融资融券余额占市值比例2.47% (融资余额1,813.53亿融券余额10.95亿2026-08-20)
中证芯片产业指数中证芯片产业指数选取业务涉及芯片设计、制造、封装与测试等领域,以及为芯片提供半导体材料、晶圆生产设备、封装测试设备等物料或设备的上市公司证券作为指数样本,以反映芯片产业上市公司证券的整体表现。®基础数据源自中证指数公司指数估值数据计算说明文档指数财务数据计算说明文档
备注 (31)双击编辑备注
发表讨论

芯片产业(H30007) - 历史市净率(市值加权)及分位点走势图

最后更新于:2026-08-21

市净率

  • 当前值:8.581
  • 当前分位点89.94%
  • 80%分位点7.460
  • 50%分位点5.303
  • 20%分位点3.815
  • 最大值:12.918
  • 平均值:5.751
  • 最小值:3.150
日期收盘点位市净率分位点20%分位点50%分位点80%分位点
2026-08-214,310.898.58189.94%3.8155.3037.460
2026-08-204,294.558.56489.81%3.8155.3007.452
2026-08-194,327.998.76990.48%3.8155.2987.438
2026-08-184,699.729.66694.34%3.8155.2967.433
2026-08-174,704.779.69894.48%3.8155.2947.432
2026-08-144,478.689.30092.01%3.8155.2897.425
2026-08-134,455.749.30692.29%3.8155.2797.414
2026-08-124,531.959.41493.10%3.8155.2797.404
2026-08-114,452.489.25591.99%3.8155.2787.391
2026-08-104,511.859.44993.37%3.8155.2767.371
2026-08-074,535.939.54394.21%3.8155.2677.371
2026-08-064,393.959.28592.56%3.8155.2667.369
2026-08-054,338.189.17192.28%3.8155.2657.366
2026-08-044,079.548.65391.71%3.8155.2647.344
2026-08-033,884.338.23890.61%3.8155.2637.309
2026-07-314,182.298.84392.15%3.8155.2607.303
2026-07-304,066.388.59591.87%3.8155.2567.301
2026-07-294,318.619.19092.41%3.8155.2557.296
2026-07-284,416.319.41193.37%3.8155.2547.294
2026-07-274,753.3610.10195.86%3.8155.2507.279
2026-07-244,733.7210.08595.87%3.8155.2477.267
2026-07-234,687.4710.04395.87%3.8155.2467.257
2026-07-224,915.5310.62296.83%3.8155.2427.249
2026-07-214,980.4510.78997.38%3.8155.2397.248