芯片产业
(H30007.csi)A股通融申编制方案单张
(
市盈率
74.70
市净率
7.36
股息率
0.15%
[静0.13%]
)·总市值加权
发布时间2012-12-20样本数50调样频率半年类型主题热点收盘点位3,746.48点位涨跌幅-0.33%成交金额1,222.99亿元总市值6.49万亿元A股市值5.50万亿元流通市值5.14万亿元自由流通市值3.47万亿元A股场内基金资产规模80.14亿元前十大权重55.90%有数据以来全收益年化涨跌幅11.95%陆股通持仓金额占市值比例3.76% (3,961.50亿元2026-06-30) 融资融券余额占市值比例2.55% (融资余额1,651.13亿元融券余额9.03亿元2026-10-08) 发布以来年化涨跌幅13.04%
中证芯片产业指数中证芯片产业指数选取业务涉及芯片设计、制造、封装与测试等领域,以及为芯片提供半导体材料、晶圆生产设备、封装测试设备等物料或设备的上市公司证券作为指数样本,以反映芯片产业上市公司证券的整体表现。®基础数据源自中证指数公司。指数估值数据计算说明文档指数财务数据计算说明文档
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芯片产业(H30007) - 历史市盈率(总市值加权)及分位点走势图

最后更新于:2026-10-09

市盈率

  • 当前值:74.70
  • 当前分位点2.34%
  • 80%分位点129.93
  • 50%分位点115.23
  • 20%分位点85.69
  • 最大值:179.73
  • 平均值:111.42
  • 最小值:70.02
日期收盘点位市盈率分位点20%分位点50%分位点80%分位点
2026-10-093,746.4874.702.34%85.69115.23129.93
2026-10-083,758.9274.902.62%85.69115.23129.93
2026-09-303,912.0278.054.97%85.69115.29129.93
2026-09-294,036.1280.748.15%85.74115.36129.93
2026-09-284,013.4180.237.19%85.82115.40129.93
2026-09-244,197.9683.8313.91%85.69115.23129.93
2026-09-234,308.8285.7420.14%85.69115.29129.93
2026-09-224,320.9186.0620.99%85.69115.36129.93
2026-09-214,283.0685.4118.23%85.69115.36129.93
2026-09-184,270.2285.2417.63%85.66115.23129.93
2026-09-174,118.9882.2411.29%85.66115.23129.93
2026-09-164,145.1782.9212.69%85.67115.29129.93
2026-09-153,970.1379.287.32%85.69115.36129.93
2026-09-143,897.9377.976.22%85.69115.36129.93
2026-09-113,972.7779.527.85%85.66115.23129.93
2026-09-104,030.6180.669.37%85.66115.23129.93
2026-09-094,052.3781.179.52%85.67115.29129.93
2026-09-084,077.9581.219.53%85.69115.36129.93
2026-09-074,135.3282.4011.46%85.69115.36129.93
2026-09-044,024.8280.369.23%85.66115.23129.93
2026-09-034,147.0682.9312.95%85.66115.23129.93
2026-09-024,176.5483.3213.66%85.67115.29129.93
2026-09-014,252.0584.9016.57%85.69115.36129.93
2026-08-314,371.4687.1423.34%85.69115.36129.93