芯片产业 (H30007.csi)A股通融申编制方案单张 | ( 市盈率 134.51 | 市净率 9.62 | 股息率 0.11% [0.11%] )·市值加权 | 发布时间2012-12-20样本数50调样频率半年类型主题热点收盘点位4,444.23点位涨跌幅-2.22%成交金额3,039.25亿元市值7.89万亿元A股市值6.52万亿元流通市值6.12万亿元自由流通市值4.02万亿元A股场内基金资产规模90.77亿元前十大权重56.02%发布以来年化涨跌幅15.18%有数据以来全收益年化涨跌幅15.89%陆股通持仓金额占市值比例3.05% (1,581.63亿元2025-12-31) 融资融券余额占市值比例2.50% (融资余额1,983.48亿元融券余额9.33亿元2026-07-17) | |
| 中证芯片产业指数选取业务涉及芯片设计、制造、封装与测试等领域，以及为芯片提供半导体材料、晶圆生产设备、封装测试设备等物料或设备的上市公司证券作为指数样本，以反映芯片产业上市公司证券的整体表现。®基础数据源自中证指数公司。指数估值数据计算说明文档指数财务数据计算说明文档 | |||||
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芯片产业(H30007) - 收益率历史月度涨跌幅列表
最后更新于：2026-07-20
| 年 | 1月 | 2月 | 3月 | 4月 | 5月 | 6月 | 7月 | 8月 | 9月 | 10月 | 11月 | 12月 | 年度涨跌幅 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 上涨概率 / 上涨中位数 | 50.00% / 0.36% | 50.00% / 2.20% | 16.67% / -7.50% | 57.14% / 1.58% | 57.14% / 0.49% | 85.71% / 8.76% | 57.14% / 2.35% | 33.33% / -6.13% | 33.33% / -5.74% | 83.33% / 3.60% | 66.67% / 1.95% | 33.33% / -2.16% | 66.67% / 29.26% |
| 2026 | 16.14% | -1.97% | -16.50% | 28.42% | 19.22% | 36.26% | -29.24% | -- | -- | -- | -- | -- | 40.35% |
| 2025 | -2.52% | 12.70% | -6.08% | 1.58% | -6.58% | 4.82% | 2.35% | 29.04% | 14.78% | -6.67% | -5.73% | 4.57% | 43.15% |
| 2024 | -23.25% | 20.86% | -4.40% | -0.18% | -1.72% | 2.79% | 5.62% | -8.91% | 22.66% | 16.60% | 2.15% | 0.56% | 26.38% |
| 2023 | 7.01% | -1.49% | 13.44% | -1.15% | -0.14% | -6.21% | -1.33% | -4.38% | -4.82% | 5.54% | -1.89% | -4.98% | -2.18% |
| 2022 | -14.92% | 5.90% | -13.54% | -15.19% | 8.75% | 8.76% | -9.83% | 1.03% | -12.91% | 3.84% | 1.75% | -4.45% | -37.41% |
| 2021 | 3.25% | -3.50% | -8.92% | 9.70% | 6.42% | 22.42% | 17.13% | -12.19% | -6.66% | 3.37% | 6.41% | -3.51% | 32.15% |
| 2020 | -- | -- | -- | 15.98% | 0.49% | 14.44% | 12.90% | -7.89% | -7.98% | 0.15% | 6.75% | -0.81% | -- |