半导体设备与材料
(H703020.恒生.三级)港股通融
(
市盈率
-38.41
市净率
3.990
股息率
0.56%
【静0.37%】
)·总市值加权
发布时间2024-06-03样本数9总市值1,573.04亿港币H股市值919.18亿港币港股通持仓金额占市值比例5.93% (102.38亿港币2026-10-13) 行业估值数据计算说明文档行业财务数据计算说明文档
二级:半导体 (H7030)
(
市盈率
107.89
市净率
3.357
股息率
0.16%
【静0.05%】
)·总市值加权
一级:资讯科技业 (H70)
(
市盈率
26.44
市净率
3.011
股息率
0.88%
)·总市值加权
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半导体设备与材料(H703020).恒生 - 历史市盈率(总市值加权)及分位点走势图

最后更新于:2026-10-16

市盈率

  • 当前值:-38.41
  • 当前分位点98.86%
  • 80%分位点-266.00
  • 50%分位点264.18
  • 20%分位点13.55
  • 最大值:1,219.33 (-32.04)
  • 平均值:42.72
  • 最小值:7.79
加载中......
日期总市值市盈率分位点20%分位点50%分位点80%分位点
2026-10-161,573.04亿港币-38.4198.86%13.55264.18-266.00
2026-10-151,571.75亿港币-38.3899.00%13.55259.67-266.93
2026-10-141,677.53亿港币-40.9697.27%13.53258.09-266.93
2026-10-131,726.69亿港币-42.1697.13%13.53256.51-269.31
2026-10-121,770.88亿港币-43.2496.83%13.53254.37-270.66
2026-10-091,793.49亿港币-43.7996.69%13.53252.24-273.34
2026-10-081,825.61亿港币-44.5796.54%13.53250.77-273.53
2026-10-071,933.38亿港币-47.2094.51%13.51249.29-273.53
2026-10-062,001.98亿港币-48.8893.05%13.51247.39-274.41
2026-10-051,992.51亿港币-48.6593.33%13.51245.48-274.46
2026-10-021,936.06亿港币-47.2794.48%13.51245.34-274.55
2026-09-301,867.15亿港币-45.5996.51%13.51245.20-275.21
2026-09-291,878.01亿港币-45.8596.07%13.50243.92-275.21
2026-09-281,806.76亿港币-44.1196.65%13.50242.64-275.75
2026-09-251,874.44亿港币-45.7796.50%13.50242.19-275.82
2026-09-241,904.39亿港币-46.5095.61%13.50241.75-276.16
2026-09-231,902.08亿港币-46.4495.75%13.50240.89-276.43
2026-09-221,892.98亿港币-46.2295.89%13.41240.02-276.43
2026-09-211,876.47亿港币-45.8296.48%13.41239.92-276.77
2026-09-181,878.68亿港币-45.8796.32%13.41239.82-277.68
2026-09-171,775.38亿港币-43.3596.76%13.41235.62-277.84
2026-09-161,769.04亿港币-43.1996.90%13.41231.42-278.57
2026-09-151,698.90亿港币-41.4897.19%13.41229.76-278.57
2026-09-141,756.39亿港币-42.8897.19%13.41228.11-279.66