window.pageData = {"stock":{"_id":1000000000002249,"areaCode":"hk","market":"h","exchange":"hk","stockType":"company","stockCode":"02249","tickerId":2249,"currency":"HKD","name":"NEXCHIP","fsTableType":"non_financial","activeHkexNewsStockId":1000308814,"hkexNewsStockIds":[1000308814],"listingStatus":"normally_listed","ipoDate":"2026-07-09T16:00:00.000Z","sharesPerLot":100,"industry":{"_id":1002000017703010,"tickerId":17703010,"areaCode":"hk","stockCode":"H703010","exchange":"hk","stockType":"industry","source":"hsi","name":"半导体","priceMetrics":{"pe_ttm":{"mcw":173.5096210369155},"pb":{"mcw":6.909435387388195},"ps_ttm":{"mcw":12.3050141284299},"dyr":{"mcw":0.0007000610442479762}},"staticDividendYieldRatio":0.0001317911902675217},"industryGroup":{"hsi":[{"_id":1002000000001770,"tickerId":1770,"stockCode":"H70","exchange":"hk","stockType":"industry","source":"hsi","name":"资讯科技业"},{"_id":1002000000177030,"tickerId":177030,"stockCode":"H7030","exchange":"hk","stockType":"industry","source":"hsi","name":"半导体"},{"_id":1002000017703010,"tickerId":17703010,"stockCode":"H703010","exchange":"hk","stockType":"industry","source":"hsi","name":"半导体"}]},"belongedIndices":[],"inclusionIndices":[],"exclusionIndices":[],"profile":{},"periodList":[],"performanceForecasts":[],"performanceBulletins":[],"priceMetrics":{},"differentMarketStocks":[]},"fsMetricsPageType":"safety","companyFsMetricsList":[],"granularities":[],"startDate":"2023-07-11T16:00:00.000Z","endDate":"2026-07-11T16:00:00.000Z","granularity":"q"}